Koelpaste (Thermal compound), 3.0 gram

* Thermal compound, 3.0 grams

* Keep your processor cool with this thermal compound. Comes in a practical syringe with a handy spatula

* Thermal compound for use with PC heatsinks

* Helps conduct heat more effectively from a CPU, chipset, or processor to a heatsink

* Excellent thermal conductivity

* Highly stable – will not separate, bleed, or run

* Electrically non-conductive

Weight: 3.0 grams

Color: Gray

Thermal conductivity: > 4.5 W/mK

Thermal impedance: < 0.205°C-in²/W

Density: > 2.5

Evaporation: < 0.001%

Volatility: < 0.005%

Dielectric constant: > 5.1

Dissipation factor: < 0.005

Viscosity: 76 cPs

Thixotropic index: 310 ± 10

Operating temperature: -50 ~ 240°C

Silicone compounds: 50%

Carbon compounds: 30%

Metal oxide compounds: 20%